Furnace Solutions for the Microelectronic Industry

The production of microelectronic components from multilayer ceramics (e.g. LTCC) sets special demands on the heat treatment process in terms of process times, temperature controls and temperature uniformity. Nabertherm offers solutions for batch processes and continuous processes that are specifically tailored to the requirements of the microelectronics industry. 

Bottom Loading Furnace for LTCC Applications  

The bottom loading furnace HF 450/10 LB DB200-2 was developed especially for debinding and sintering of LTCC (low temperature co-fired ceramics). The insulation of the furnace hood with high-quality fiber material makes fast process cycles possible. Multi-zone heating (side bottom, side middle and side top) ensures precise temperature control and optimum temperature uniformity in the workspace.  

Continuous Furnace for Burn-Out and Firing/Sintering  

The continuous furnaces of the DF series are designed for continuous processes in air and are therefore suitable for thick-film applications and LTCC firing processes. The product (usually charged on a carrier plate) is moved through the furnace on a metal belt, loading and unloading takes place at approx. 500 mm long entry and exit zones in front of and behind the furnace. The temperature curve for the process can be adjusted to suit product requirements via the several control zones located one behind the other and via the belt speed (adjustable between approx. 20 - 300 mm/min).  

Individual Solutions through Tailored Engineering  

With versatile additional equipment and expansion options, both product series offer an ideal basis for the development of customer-specific heat treatment systems.  

Further information of furnaces for the microelectronic industry